PT. Dataindo Inti Swakarsa

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•Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. HS: 84.86
• Apparatus for rapid heating of semiconductor wafers. HS: 8486.10.10.00
• Spin dryers for semiconductor wafer processing. HS: 8486.10.20.00
• Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers. HS: 8486.10.30.00
• Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips. HS: 8486.10.40.00
• Grinding, polishing and lapping machines for processing of semiconductor wafers. HS: 8486.10.50.00
• Apparatus for growing or pulling monocrystal semiconductor boules. HS: 8486.10.60.00
• Other. HS: 8486.10.90.00
• Chemical vapour deposition apparatus for semiconductor production. HS: 8486.20.11.00
• Epitaxial deposition machines for semiconductor wafers; spinners for coating photographic emulsions on semiconductor wafers. HS: 8486.20.12.00
• Apparatus for physical deposition by sputtering on semiconductor wafers; physical deposition apparatus for semiconductor production. HS: 8486.20.13.00
• Other. HS: 8486.20.19.00
• Ion implanters for doping semiconductor materials. HS: 8486.20.21.00
• Other. HS: 8486.20.29.00
• Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electro plating process; spraying appliances for etching, stripping or cleaning semiconductor wafers. HS: 8486.20.31.00
• Equipment for dry etching patterns on semiconductor materials HS: 8486.20.32.00
• Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers. HS: 8486.20.33.00
• Other. HS: 8486.20.39.00
• Direct write on wafer apparatus. HS: 8486.20.41.00
• Step and repeat aligners. HS: 8486.20.42.00
• Other. HS: 8486.20.49.00
• Dicing machines for scribing or scoring semiconductor wafers. HS: 8486.20.51.00
• Other. HS: 8486.20.59.00
• Lasercutters for cut ting contacting tracks in semiconductor production by laser beam. HS: 8486.20.91.00
• Machines for bending, folding and straightening semiconductor leads. HS: 8486.20.92.00
• Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.20.93.00
• Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.20.94.00
• Automated machines for the placement or the removal of components or contact elements on semiconductor materials. HS: 8486.20.95.00
• Other. HS: 8486.20.99.00
• Apparatus for dry etching patterns on flat panel display substrates. HS: 8486.30.10.00
• Apparatus for wet etching, developing, stripping or cleaning flat panel displays HS: 8486.30.20.00
• Chemical vapour deposition apparatus for flat panel display production; spinners for coating photosensitive emulsions on flat panel display substrates; apparatus for physical deposition on flat panel display substrates. HS: 8486.30.30.00
• Other. HS: 8486.30.90.00
• Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices. HS: 8486.40.10.00
• Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices. HS: 8486.40.20.00
• Moulds for manufacture of semiconductor devices. HS: 8486.40.30.00
• Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.40.00
• Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.50.00
• Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.60.00
• Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates. HS: 8486.40.70.00
• Other. HS: 8486.40.90.00
• Of apparatus for rapid heating of semiconductor wafers. HS: 8486.90.11.00
• Of spin dryers for semiconductor wafer processing. HS: 8486.90.12.00
• Of machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers. HS: 8486.90.13.00
• Tool holders and self opening dieheads; work holders; dividing heads and other special attachments for machine tools. HS: 8486.90.14.00
• Other. HS: 8486.90.15.00
• Of grinding, polishing and lapping machines for processing of semiconductor wafers HS: 8486.90.16.00
• Of apparatus for growing or pulling monocrystal semiconductor boules. HS: 8486.90.17.00
• Other. HS: 8486.90.19.00
• Of chemical vapour deposition apparatus for semiconductor production. HS: 8486.90.21.00
• Of epitaxial deposition machines for semiconductor wafers; of spinners for coating photographic emulsions on semiconductor wafers. HS: 8486.90.22.00
• Of ion implanters for doping semiconductor materials; of apparatus for physical deposition by sputtering on semiconductor wafers; of physical deposition apparatus for semiconductor production; of direct write on wafer apparatus, step and repeat aligners and other lithography equipment. HS: 8486.90.23.00
• Other. HS: 8486.90.25.00
• Tool holders and self opening dieheads; workholders; dividing heads and other special attachment for machine tools. HS: 8486.90.26.00
• Other. HS: 8486.90.27.00
• Of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers; of inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.90.28.00
• Other. HS: 8486.90.29.00
• Of apparatus for dry etching patterns on flat panel display substrates. HS: 8486.90.31.00
• Tool holders and self opening dieheads; work holders; dividing heads and other special attachments for machine tools. HS: 8486.90.32.00
• Other. HS: 8486.90.33.00
• Of chemical vapour deposition apparatus for flat panel display production. HS: 8486.90.34.00
• Of spinners for coating photosensitive emulsions on flat panel display substrates. HS: 8486.90.35.00
• Of apparatus for physical deposition on flat panel display substrates. HS: 8486.90.36.00
• Other. HS: 8486.90.39.00
• Of focused ion beam milling machine to produce or repair masks and reticles for for patterns on semiconductor devices. HS: 8486.90.41.00
• Of die attach apparatus, tape automated bonders, wire bonders and of encapsulation equipment for assembly of semiconductors. HS: 8486.90.42.00
• Of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices. HS: 8486.90.43.00
• Of optical stereoscopic and photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.90.44.00
• Of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.90.45.00
• Of pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates, including printed circuit assemblies. HS: 8486.90.46.00
• Other. HS: 8486.90.49.00

Industry News
Minister of Industry Persuades Taiwan to Develop Machine Industry: http://industri.kontan.co.id/news/menperin-bujuk-taiwan-kembangkan-industri-mesin/30 November 2016
Minister of Industry Airlangga Hartarto invited Taiwan investors to make Indonesia the production base of machinery and equipment manufacturing industry and hopes that the cooperation could increase the trade volume of both countries.

Airlangga said, the Government of Indonesia is ready to facilitate Taiwan investors who will invest and develop its business in Indonesia.

Taiwan is one of the main suppliers of manufacturing machinery for the Indonesian market over the last five years. The import value of manufacturing machinery from Taiwan reached US $ 79.68 million in 2015. Meanwhile, the volume of Indonesia - Taiwan handling in 2015 reached US $ 8.9 billion which includes exports amounted to US $ 3.03 billion and imports worth US $ 5.9 billion.
Turkey Interested to Invest Shipping in Batam : http://www.antarakepri.com/berita/34168/turki-tertarik-berinvestasi-perkapalan-di-batam/9 July 2015
The Turkish company PT. Turkindo Jaya, expressed interest to invest in the field of shipping in the Free Trade Zone and Free Port of Batam, Riau Islands Province. The company is engaged in general trading and mining consultant. The company has extensive experience and good trade relations between Indonesia and Turkey and serves the provision of machinery for manufacturers of pipes and tubes of iron, machinery steel industry, machinery and equipment bending, machinery and equipment ponds, cutting machines sheet iron and steel, machine laser cutting, and plasma. Director of Promotion and Public Relations, Purnomo Andiantono said that currently about 70 percent of Indonesian shipyard in Batam. He said the number of shipyards that there are currently about 110 companies include enterprises large to small.
 
HS No. 8486.90.24.00
1 July 2019
Trade Data 2018

Definition
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. Parts and accessories : Of machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits : Of ion implanters for doping semiconductor materials; of apparatus for physical deposition by sputtering on semiconductor wafers; of physical deposition apparatus for semiconductor production; of direct write-on-wafer apparatus, step and repeat aligners and other lithography equipment. Tool holders and self-opening dieheads; work holders; dividing heads and other special attachment for machine tools.
PT. Dataindo Inti SwakarsaTelp : (62 - 21) 719 3832
3rd Floor, Gapura Raya BuildingTelp : (62 - 21) 719 3834
Jl. Bangka Raya No. 4, Pela Mampang Email : info@disb2b.com
Jakarta 12720, Indonesia
Chapter Headings US $ Select All
Import Duty 1.00
Value Added Tax 1.00
Total Tax 1.00
Import Trade Figures 5.00
Countries of Origin [6] 0.60

Report Content
APPLICABLE TAXES AND DUTIES NORMAL RATE % PREFFERENTIAL RATE %
Import Duty 15.0 5.0
Value Added Tax 10.0 10.0
Luxury Tax 0.0 0.0
Total Tax 26.5 15.5
Ministerial Decree No. 133/PMK.01/2005 date December 23, 2005
The data above is sample data only
Current
IMPORTED INTO INDONESIA 2007 2008 2009
CIF (US) 23,027,318 19,067,348 20,447,454
Quantity (Unit) 2,123,329 3,698,379 5,453,456
Weight (Kg) 7,221,440 11,661,880 12,567,123
The data above is sample data only
Historical
IMPORTED INTO INDONESIA 2002 2003 2004 2005 2006
CIF (US) 7,374,478 10,047,482 10,842,850 7,459,774 16,714,619
Quantity (Unit) 1,887,946 2,489,655 3,303,849 494,569 788,285
Weight (Kg) 4,905,807 6,478,645 7,073,154 6,222,921 11,604,996
The data above is sample data only
Current
EXPORTED FROM INDONESIA 2007 2008 2009
FOB (US) 110,581 130,768 135,342
Quantity (Unit) 100,465 246,561 144,567
Weight (Kg) 73,787 93,685 90,768
The data above is sample data only
Historical
EXPORTED FROM INDONESIA 2002 2003 2004 2005 2006
FOB (US) 8,536,653 6,826,064 2,540,297 1,832,218 1,227,393
Quantity (Unit) 1,319,636 2,565,227 183,309 245,746 2,956,615
Weight (Kg) 8,496,901 5,326,395 1,861,318 1,497,720 1,404,649
The data above is sample data only
Current
COUNTRIES OF ORIGIN IN 2009 US %
Malaysia 9,024,355 53.99
Singapore 4,920,377 29.44
Philippines 2,386,376 14.28
Ireland 326,250 1.95
Netherlands 38,372 0.23
Australia 13,627 0.08
United Kingdom 4,229 0.02
United States 796 < 0.01
Taiwan 237 < 0.01
Total 16,714,619 100
The data above is sample data only
Current
COUNTRIES OF DESTINATION IN 2009 US %
Japan 967,895 78.86
Saudi Arabia 43,105 3.51
Kuwait 32,614 2.66
Malaysia 30,923 2.52
Australia 26,865 2.19
Romania 20,146 1.64
Timor Leste 17,964 1.46
Solomon Islands 17,216 1.4
Singapore 16,630 1.35
Eritrea 16,065 1.31
United Arab Emirates 13,419 1.09
Madagascar 7,928 0.65
India 4,840 0.39
Oman 4,640 0.38
United States 2,835 0.23
Qatar 2,786 0.23
Bangladesh 1,130 0.09
Hongkong 360 0.02
New Zealand 32 < 0.01
Total 1,227,393 100
The data above is sample data only
   
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