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•Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. HS: 84.86
• Apparatus for rapid heating of semiconductor wafers. HS: 8486.10.10.00
• Spin dryers for semiconductor wafer processing. HS: 8486.10.20.00
• Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers. HS: 8486.10.30.00
• Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips. HS: 8486.10.40.00
• Grinding, polishing and lapping machines for processing of semiconductor wafers. HS: 8486.10.50.00
• Apparatus for growing or pulling monocrystal semiconductor boules. HS: 8486.10.60.00
• Other. HS: 8486.10.90.00
• Chemical vapour deposition apparatus for semiconductor production. HS: 8486.20.11.00
• Epitaxial deposition machines for semiconductor wafers; spinners for coating photographic emulsions on semiconductor wafers. HS: 8486.20.12.00
• Apparatus for physical deposition by sputtering on semiconductor wafers; physical deposition apparatus for semiconductor production. HS: 8486.20.13.00
• Other. HS: 8486.20.19.00
• Ion implanters for doping semiconductor materials. HS: 8486.20.21.00
• Other. HS: 8486.20.29.00
• Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electro plating process; spraying appliances for etching, stripping or cleaning semiconductor wafers. HS: 8486.20.31.00
• Equipment for dry etching patterns on semiconductor materials HS: 8486.20.32.00
• Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers. HS: 8486.20.33.00
• Other. HS: 8486.20.39.00
• Direct write on wafer apparatus. HS: 8486.20.41.00
• Step and repeat aligners. HS: 8486.20.42.00
• Other. HS: 8486.20.49.00
• Dicing machines for scribing or scoring semiconductor wafers. HS: 8486.20.51.00
• Other. HS: 8486.20.59.00
• Lasercutters for cut ting contacting tracks in semiconductor production by laser beam. HS: 8486.20.91.00
• Machines for bending, folding and straightening semiconductor leads. HS: 8486.20.92.00
• Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.20.93.00
• Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.20.94.00
• Automated machines for the placement or the removal of components or contact elements on semiconductor materials. HS: 8486.20.95.00
• Other. HS: 8486.20.99.00
• Apparatus for dry etching patterns on flat panel display substrates. HS: 8486.30.10.00
• Apparatus for wet etching, developing, stripping or cleaning flat panel displays HS: 8486.30.20.00
• Chemical vapour deposition apparatus for flat panel display production; spinners for coating photosensitive emulsions on flat panel display substrates; apparatus for physical deposition on flat panel display substrates. HS: 8486.30.30.00
• Other. HS: 8486.30.90.00
• Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices. HS: 8486.40.10.00
• Moulds for manufacture of semiconductor devices. HS: 8486.40.30.00
• Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.40.00
• Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.50.00
• Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.40.60.00
• Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates. HS: 8486.40.70.00
• Other. HS: 8486.40.90.00
• Of apparatus for rapid heating of semiconductor wafers. HS: 8486.90.11.00
• Of spin dryers for semiconductor wafer processing. HS: 8486.90.12.00
• Of machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers. HS: 8486.90.13.00
• Tool holders and self opening dieheads; work holders; dividing heads and other special attachments for machine tools. HS: 8486.90.14.00
• Other. HS: 8486.90.15.00
• Of grinding, polishing and lapping machines for processing of semiconductor wafers HS: 8486.90.16.00
• Of apparatus for growing or pulling monocrystal semiconductor boules. HS: 8486.90.17.00
• Other. HS: 8486.90.19.00
• Of chemical vapour deposition apparatus for semiconductor production. HS: 8486.90.21.00
• Of epitaxial deposition machines for semiconductor wafers; of spinners for coating photographic emulsions on semiconductor wafers. HS: 8486.90.22.00
• Of ion implanters for doping semiconductor materials; of apparatus for physical deposition by sputtering on semiconductor wafers; of physical deposition apparatus for semiconductor production; of direct write on wafer apparatus, step and repeat aligners and other lithography equipment. HS: 8486.90.23.00
• Tool holders and self opening dieheads; work holders; dividing heads and other special attachment for machine tools. HS: 8486.90.24.00
• Other. HS: 8486.90.25.00
• Tool holders and self opening dieheads; workholders; dividing heads and other special attachment for machine tools. HS: 8486.90.26.00
• Other. HS: 8486.90.27.00
• Of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers; of inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers. HS: 8486.90.28.00
• Other. HS: 8486.90.29.00
• Of apparatus for dry etching patterns on flat panel display substrates. HS: 8486.90.31.00
• Tool holders and self opening dieheads; work holders; dividing heads and other special attachments for machine tools. HS: 8486.90.32.00
• Other. HS: 8486.90.33.00
• Of chemical vapour deposition apparatus for flat panel display production. HS: 8486.90.34.00
• Of spinners for coating photosensitive emulsions on flat panel display substrates. HS: 8486.90.35.00
• Of apparatus for physical deposition on flat panel display substrates. HS: 8486.90.36.00
• Other. HS: 8486.90.39.00
• Of focused ion beam milling machine to produce or repair masks and reticles for for patterns on semiconductor devices. HS: 8486.90.41.00
• Of die attach apparatus, tape automated bonders, wire bonders and of encapsulation equipment for assembly of semiconductors. HS: 8486.90.42.00
• Of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices. HS: 8486.90.43.00
• Of optical stereoscopic and photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.90.44.00
• Of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. HS: 8486.90.45.00
• Of pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates, including printed circuit assemblies. HS: 8486.90.46.00
• Other. HS: 8486.90.49.00

Industry News
Machine Rejuvenation Can Boost Manufacturing Performance: https://ekonomi.bisnis.com/read/20191010/257/1157932/peremajaan-mesin-bisa-dongkrak-kinerja-man Manufacturing/10 October 2019
The Indonesian Employers Association (Apindo) assesses that the decline in the contribution of the manufacturing sector to gross domestic product (GDP) occurs because the use of technology tends to be stagnant.

Deputy Chairperson of Apindo, Shinta W. Kamdani, said that machine rejuvenation in several industrial sectors was not even carried out. As a result, the productivity of the industry is low. According to him, the difficulty in implementing engine rejuvenation is due to the lack of capital.
Astragraphia Strategy Encouraging Printing Industry in Indonesia: http://tekno.liputan6.com/read/3082639/jurus-astragraphia-dorong-industri-printing-di-indonesia/4 September 2017
Smartphone penetration reaching 142 per cent and the number of internet users in the country that continues to grow to 132.7 million users, making PT Astragraphia Xprins Indonesia more observant in seeing the trend.

Sahat Sihombing, President Director of PT Astragraphia Xprins Indonesia said that the trend is an opportunity to accelerate printing business. The digital revolution allows businesses to get order printing from anywhere and anytime. The strategy is run by the company through a single online printing platform that is PrintQoe.com, which is the first B2B online printing in Indonesia that provides many ease and business benefits for corporate customers and printing businesses, without having to come to a printing location to become an integrated, modern, fast, precise, and efficient printing solution.

Based on reports from Smithers Pira, the global printing industry market is expected to grow to US $ 980 billion in 2018, where growth is driven by increasing demand for digital printing. The digital printing market grew twice from 9.5 percent in 2008 to 19.7 percent by 2018.
 
HS No. 8486.40.20.00
1 July 2019
Trade Data 2018

Definition
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. Machines and apparatus specified in Note 9 (C) to this chapter : Die attach apparatus, tape automated bonders, wire bonders and encapsulation equipment for assembly of semiconductors; automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices.
PT. Dataindo Inti SwakarsaTelp : (62 - 21) 719 3832
3rd Floor, Gapura Raya BuildingTelp : (62 - 21) 719 3834
Jl. Bangka Raya No. 4, Pela Mampang Email : info@disb2b.com
Jakarta 12720, Indonesia
Chapter Headings US $ Select All
Import Duty 1.00
Value Added Tax 1.00
Total Tax 1.00
Import Trade Figures 5.00
Export Trade Figures 5.00
Countries of Origin [12] 1.20

Report Content
APPLICABLE TAXES AND DUTIES NORMAL RATE % PREFFERENTIAL RATE %
Import Duty 15.0 5.0
Value Added Tax 10.0 10.0
Luxury Tax 0.0 0.0
Total Tax 26.5 15.5
Ministerial Decree No. 133/PMK.01/2005 date December 23, 2005
The data above is sample data only
Current
IMPORTED INTO INDONESIA 2007 2008 2009
CIF (US) 23,027,318 19,067,348 20,447,454
Quantity (Unit) 2,123,329 3,698,379 5,453,456
Weight (Kg) 7,221,440 11,661,880 12,567,123
The data above is sample data only
Historical
IMPORTED INTO INDONESIA 2002 2003 2004 2005 2006
CIF (US) 7,374,478 10,047,482 10,842,850 7,459,774 16,714,619
Quantity (Unit) 1,887,946 2,489,655 3,303,849 494,569 788,285
Weight (Kg) 4,905,807 6,478,645 7,073,154 6,222,921 11,604,996
The data above is sample data only
Current
EXPORTED FROM INDONESIA 2007 2008 2009
FOB (US) 110,581 130,768 135,342
Quantity (Unit) 100,465 246,561 144,567
Weight (Kg) 73,787 93,685 90,768
The data above is sample data only
Historical
EXPORTED FROM INDONESIA 2002 2003 2004 2005 2006
FOB (US) 8,536,653 6,826,064 2,540,297 1,832,218 1,227,393
Quantity (Unit) 1,319,636 2,565,227 183,309 245,746 2,956,615
Weight (Kg) 8,496,901 5,326,395 1,861,318 1,497,720 1,404,649
The data above is sample data only
Current
COUNTRIES OF ORIGIN IN 2009 US %
Malaysia 9,024,355 53.99
Singapore 4,920,377 29.44
Philippines 2,386,376 14.28
Ireland 326,250 1.95
Netherlands 38,372 0.23
Australia 13,627 0.08
United Kingdom 4,229 0.02
United States 796 < 0.01
Taiwan 237 < 0.01
Total 16,714,619 100
The data above is sample data only
Current
COUNTRIES OF DESTINATION IN 2009 US %
Japan 967,895 78.86
Saudi Arabia 43,105 3.51
Kuwait 32,614 2.66
Malaysia 30,923 2.52
Australia 26,865 2.19
Romania 20,146 1.64
Timor Leste 17,964 1.46
Solomon Islands 17,216 1.4
Singapore 16,630 1.35
Eritrea 16,065 1.31
United Arab Emirates 13,419 1.09
Madagascar 7,928 0.65
India 4,840 0.39
Oman 4,640 0.38
United States 2,835 0.23
Qatar 2,786 0.23
Bangladesh 1,130 0.09
Hongkong 360 0.02
New Zealand 32 < 0.01
Total 1,227,393 100
The data above is sample data only
   
TOTAL PRICE (US$)(RP)
Price 25.00412.500
Payment Method
Credit Card
Bank Transfer in US$
Bank Transfer in RP
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